When it comes to automated optical inspection (AOI) everybody talks about 3D. However, is this only a marketing tool or is it the solution to the increasing demands placed on soldered printed-circuit board (PCB) inspection?
Furthermore, 3D technology brings new insight, making height data available to evaluate for the first time. What is the significance of this data and how reliable can it be recorded? Let’s examine the strengths and weaknesses of 2D technology:
Limitations and strengths of 2D technology
Nowadays, 3d solder paste inspection system the current. Highly sophisticated, it’s an effective method of carrying out an inspection post-reflow. But, the features provided by the various systems for sale differ in several aspects, such as the resolution of the camera (in millimeters per pixel) and the dimensions of the camera’s sensor (number of pixels), and the field of view that results from the resolution and size of the camera and frame rates (number of images captured per second) as well as the camera angles as well as the capture of full-resolution color images (three-color separations that have an entire number of pixels) algorithm-based image processing or image comparison and multi-colored illumination that can be viewed from the most diverse directions as it is possible.
The higher the quality of the specific attributes, the better the overall AOI performance. This is measured by the speed of operation and defects detection (as few defects that are not detected as are possible is desirable) and the pseudo-defect rate. In addition to the image’s high-quality, meant to show the defects in a way that they can be easily identified and easily identifiable, the software (algorithm-based imaging processing) plays an important function to play. The more efficient the algorithms utilized for fully automated evaluation of defects and detection, the simpler it will be that the end-user can choose the correct settings for defect detection.
To use 2D Automated optical inspection technology, cameras with angled views are a crucial method to obtain good results on defects. This is because they can attain full sharpness as well as depth across the full field of view. This is something that can be achieved when intelligent solutions are employed. The market has recognized that the angled view offers much more detail than the traditional vertical inspection.
With a high-quality camera along with a software program, these 2D devices provide many capabilities including inspection of all solder joints visible including the gullwing ICs optical character recognition and Data matrix reading easy identification of certain types of polarity marks high-throughput, affordable costs, and a few issues that result from shadowing.
